IC DESIGN TECHNOLOGIES
Group A
Introduction to IC design flow: System specification to final packaging.
MOS transistor, CMOS inverter, static and dynamic logic circuits, latch up problem in CMOS.
Factors for optimization (speed, power, area, etc.)
Timing issues: Clock skew, critical path, logic hazards,
etc.
Interconnect: Capacitive, resistive and inductive parasitics
Basic concepts of partitioning, floor planning, placement, routing and layout. Design rule and circuit extraction, mask making procedure.
Computer aided design, simulation and testing, behavioral modeling and hardware description language.
Group B
Memories and other replicable structures: ROM, PROM, EPROM, E2PROM, Static RAM and dynamic RAM, PLA and PAL.
Basic design methodologies: Full custom and semicustom
design. ASIC vs. field programmable devices.
Basic fabrication technology: Bipolar and MOS processing steps and important process parameters.
Importance of semiconductor device modeling.
Computer aided design.
Recommended Rooks
• N H E Weste and K Eshraghian. Principles of CMOS
VLSIDesign. Addison Wesley Publishing Co., New York.
• J M Rabaey. Digital Integrated Circuits. Prentice-Hall of
India (P) Ltd. New Delhi.